NSP1 Series Liquid Cooling Quick Disconnect Couplings

NSP1 Series Quick Disconnect Couplings for Data Center Liquid Cooling

The NSP1 Series Quick Disconnect (QD) Couplings are a critical component of modern data center liquid cooling systems, engineered for optimal fluid flow to reduce pressure drop and maximize overall system efficiency. Designed, tested, and validated in collaboration with hyperscale customers, NSP1 couplings deliver reliable, high-performance, leak-resistant connections across servers, rackable systems, and supercomputers.

Manufactured from high-quality stainless steel, NSP1 QDs are available in a wide variety of port configurations including male thread, female thread, hosebarb, and pushlok hosebarb, making them compatible with rack manifolds, flexible hoses, and diverse IT cooling architectures. Each coupling is assembled and tested in a clean room environment to minimize contamination, with final assemblies verified via helium-leak testing to ensure robust performance and trusted quality.

Key Features & Benefits

• Flush-face valve design prevents fluid loss and protects sensitive electronics
• Reduced pressure drop for superior energy efficiency and system performance
• End-of-line helium leak testing ensures quality and reliability
• Clean room assembly reduces contamination risks
• Red and blue color coding options for easy identification
• Approved for OCP Project Deschutes CDU applications

Applications & Markets

• Information Technology and Electronics
• Data Centers and Server Farms
• High-Performance Computing and Supercomputers
• Rackable Server Systems and Liquid Cooling Loops
• Industrial and Mission-Critical IT Cooling Solutions

Technical Specifications

• Size: 1/4 inch
• Material: Stainless Steel
• Port Ends: Male Thread, Female Thread, Hosebarb, Pushlok Hosebarb
• Seal Material: EPDM

The NSP1 Series combines OCP-approved design, high-quality materials, and precision manufacturing to deliver dependable, leak-free quick disconnect couplings that enhance efficiency, reliability, and ease of maintenance for today’s advanced liquid-cooled IT infrastructures.