Parker’s 629 Server Blade Hose is a premium thermal cooling hose engineered for advanced thermal management systems and demanding fluid transfer applications. As the latest addition to Parker’s thermal cooling product line, the 629 hose combines flexibility, compact design, and high-performance materials to meet the evolving needs of data centers, server cooling, electronics cooling, and industrial thermal management systems.
Constructed with a peroxide-cured EPDM tube, Parker’s 629 hose is specifically designed to provide enhanced sealing performance, improved fluid purity, and exceptional thermal resistance. Its specially formulated EPDM construction helps maintain system integrity while supporting long-term reliability in high-temperature and mission-critical cooling environments.
The compact outside diameter (O.D.) and highly flexible construction make the 629 Server Blade Hose ideal for tight installation spaces and complex hose routing applications. With an extremely tight bend radius, installers can achieve cleaner routing with reduced space requirements, making it especially effective for compact thermal cooling assemblies and high-density equipment layouts.
Designed with durability and safety in mind, the hose cover offers superior flame and ozone resistance, including a UL94 V-0 flame resistance rating for added protection in sensitive operating environments. Parker’s 629 hose also delivers dependable low-pressure performance with a 150 PSI working pressure and a 4:1 safety factor for enhanced operational confidence.
Features & Benefits
- Peroxide-cured EPDM tube for improved sealing and increased fluid purity
- Enhanced thermal resistance for demanding cooling applications
- Compact O.D. reduces space requirements in tight installations
- Flexible construction simplifies routing in confined spaces
- Extremely tight bend radius for easier installation
- UL94 V-0 flame-resistant cover for increased safety
- Ozone-resistant cover enhances durability and longevity
- 150 PSI working pressure with a 4:1 safety factor
- Ideal for server cooling, thermal management systems, and electronics cooling applications
